Thermal Overview
Thermal Overview
Abstract
Linux Thermal 是 Linux 系统下温度控制相关的模块,主要用来控制系统运行中芯片产生的热量。配合 ic 内部温度传感器,对 ic 温度进行管控,保证系统稳定性[1]。
其基本的架构可以简单概括为下图:
Thermal 中有一些基础概念,下文会结合定义的代码对其进行分析。
Thermal Zone Device
Thermal Zone 代表一个温控区间,将其看成一个虚拟的温度 sensor, 但是需要有物理 sensor 与其关联才可以发挥作用。 需要注意的是,一个 Thermal zone 最多可以关联一个 sensor, 但是一个 sensor 可以是多个硬件 Sensor 的混合。
🤔🤔🤔 为什么一个 Thermal zone 只能关联一个 sensor? 系统中会有多个 Thermal zone 吗?
Thermal Zone Device 在 Thermal 框架中理解为获取温度的设备。
我们列举并分析其结构组成:
// thermal.h
struct thermal_zone_device {
int id;
char type[THERMAL_NAME_LENGTH];
struct device device;
struct attribute_group trips_attribute_group;
struct thermal_attr *trip_temp_attrs;
struct thermal_attr *trip_type_attrs;
struct thermal_attr *trip_hyst_attrs;
void *devdata;
int trips;
unsigned long trips_disabled; /* bitmap for disabled trips */
int passive_delay;
int polling_delay;
int temperature;
int last_temperature;
int emul_temperature;
int passive;
int prev_low_trip;
int prev_high_trip;
unsigned int forced_passive;
atomic_t need_update;
struct thermal_zone_device_ops *ops;
struct thermal_zone_params *tzp;
struct thermal_governor *governor;
void *governor_data;
struct list_head thermal_instances;
struct ida ida;
struct mutex lock;
struct list_head node;
struct delayed_work poll_queue;
enum thermal_notify_event notify_event;
}
为了更方便分析,我们给出一个简单的类图:
thermal_zone_params *tzp
在上述结构体的 24 行,结构体细节如下:
/* Structure to define Thermal Zone parameters */
struct thermal_zone_params {
char governor_name[THERMAL_NAME_LENGTH];
bool no_hwmon;
int num_tbps;
struct thermal_bind_params *tbp;
u32 sustainable_power;
s32 k_po;
s32 k_pu;
s32 k_i;
s32 k_d;
s32 integral_cutoff;
int slope;
int offset;
};
🟡🟡🟡发散:如寻找对应的 governor: governor = __find_governor(tz->tzp->governor_name);
就用到了 tzp->governor_name
这个参数。
我们看一下 tzp
的位置:
我们去掉原生代码中的注释信息,然后用表格的形式一一分析这些参数:
param | type | comments | means |
---|---|---|---|
governor_name | char[] | ||
no_hwmon | bool | a boolean to indicate if the thermal to hwmon sysfs interface is required. when no_hwmon == false, a hwmon sysfs interface will be created. when no_hwmon == true, nothing will be done | |
num_tbps | int | Number of tbp entries | |
tbp | struct | Structure that holds binding parameters for a zone | struct thermal_bind_params 结构体定义在 thermal.h |
sustainable_power | u32 | Sustainable power (heat) that this thermal zone can dissipate in mW | 该热区可消散的持续功率 |
k_po | s32 | Proportional parameter of the PID controller when | PID 控制器的比例参数 |
k_pu | s32 | Proportional parameter of the PID controller when undershooting | |
k_i | s32 | Integral parameter of the PID controller | |
k_d | s32 | Derivative parameter of the PID controller | |
integral_cutoff | s32 | threshold below which the error is no longer accumulated | 低于此阈值的错误将不再累计 |
slope | int | slope of a linear temperature adjustment curve. | 线性温度调节曲线的斜率 |
offset | int | offset of a linear temperature adjustment curve. | 线性温度调节曲线的偏移 |
s32, u32 in int-l64.h
typedef __signed__ int __s32;
typedef unsigned int __u32;
thermal_bind_params
thermal_bind_params (thermal.h)结构体如下:
/* Structure that holds binding parameters for a zone */
struct thermal_bind_params {
struct thermal_cooling_device *cdev;
int weight;
int trip_mask;
unsigned long *binding_limits;
int (*match) (struct thermal_zone_device *tz,
struct thermal_cooling_device *cdev);
};
在深入分析之前,我们需要了解到,thermal_bind_params
隶属结构如下:
param | type | comments | means |
---|---|---|---|
weight | int | This is a measure of 'how effectively these devices can cool 'this' thermal zone. It shall be determined by platform characterization. This value is relative to the rest of the weights so a cooling device whose weight is double that of another cooling device is twice as effective. See Documentation/driver-api/thermal/sysfs-api.rst for more information. | |
trip_mask | int | This is a bit mask that gives the binding relation between this thermal zone and cdev, for a particular trip point. | |
binding_limits | unsigned long | This is an array of cooling state limits. Must have exactly 2 * thermal_zone.number_of_trip_points. It is an array consisting of tuples <lower-state upper-state> of state limits. Each trip will be associated with one state limit tuple when binding. A NULL pointer means <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips. | |
match | int (*match) (struct thermal_zone_device *tz, struct thermal_cooling_device *cdev); |
thermal_zone_device_ops *ops
指的是 thermal 可以操作的类型:
其隶属的结构如下:
其结构体定义如下:
struct thermal_zone_device_ops {
int (*bind) (struct thermal_zone_device *,
struct thermal_cooling_device *);
int (*unbind) (struct thermal_zone_device *,
struct thermal_cooling_device *);
int (*get_temp) (struct thermal_zone_device *, int *);
int (*set_trips) (struct thermal_zone_device *, int, int);
int (*get_mode) (struct thermal_zone_device *,
enum thermal_device_mode *);
int (*set_mode) (struct thermal_zone_device *,
enum thermal_device_mode);
int (*get_trip_type) (struct thermal_zone_device *, int,
enum thermal_trip_type *);
int (*get_trip_temp) (struct thermal_zone_device *, int, int *);
int (*set_trip_temp) (struct thermal_zone_device *, int, int);
int (*get_trip_hyst) (struct thermal_zone_device *, int, int *);
int (*set_trip_hyst) (struct thermal_zone_device *, int, int);
int (*get_crit_temp) (struct thermal_zone_device *, int *);
int (*set_emul_temp) (struct thermal_zone_device *, int);
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
int (*notify) (struct thermal_zone_device *, int,
enum thermal_trip_type);
};
int (*get_temp)
获取温度 int (*get_temp) (struct thermal_zone_device *, int *);
if (d->override_ops && d->override_ops->get_temp)
return d->override_ops->get_temp(zone, temp);
int (*get_trip_temp)
在 thermal_sysfs.c
中调用:
static ssize_t
trip_point_temp_show(struct device *dev, struct device_attribute *attr,
char *buf)
{
struct thermal_zone_device *tz = to_thermal_zone(dev);
int trip, ret;
int temperature;
if (!tz->ops->get_trip_temp)
return -EPERM;
if (sscanf(attr->attr.name, "trip_point_%d_temp", &trip) != 1)
return -EINVAL;
ret = tz->ops->get_trip_temp(tz, trip, &temperature);
if (ret)
return ret;
return sprintf(buf, "%d\n", temperature);
}
int (*set_trip_temp)
static ssize_t
trip_point_temp_store(struct device *dev, struct device_attribute *attr,
const char *buf, size_t count)
{
struct thermal_zone_device *tz = to_thermal_zone(dev);
int trip, ret;
int temperature, hyst = 0;
enum thermal_trip_type type;
if (!tz->ops->set_trip_temp)
return -EPERM;
if (sscanf(attr->attr.name, "trip_point_%d_temp", &trip) != 1)
return -EINVAL;
if (kstrtoint(buf, 10, &temperature))
return -EINVAL;
ret = tz->ops->set_trip_temp(tz, trip, temperature);
if (ret)
return ret;
if (tz->ops->get_trip_hyst) {
ret = tz->ops->get_trip_hyst(tz, trip, &hyst);
if (ret)
return ret;
}
ret = tz->ops->get_trip_type(tz, trip, &type);
if (ret)
return ret;
thermal_notify_tz_trip_change(tz->id, trip, type, temperature, hyst);
thermal_zone_device_update(tz, THERMAL_EVENT_UNSPECIFIED);
return count;
}
这个调用中有几个知识点可以注意的:
关于
sscanf()
:sscanf(attr->attr.name, "trip_point_%d_temp", &trip) != 1
, 这个调用的意思是说,attr->attr.name
类似于trip_point_123_temp
, 然后我们可以把这个123
拿出来写进trip
中去,并返回写入变量的个数。在这个例子中我们只写入了trip
, 所以写入成功的话就返回1
.kstrtoint(buf, 10, &temperature)
是将字符串转化为int
整数,我们将buf
中的值以 10 进制的形式传递给了temperature
.返回的错误码:
#define EINVAL 22
;#define EPERM 1;
Trip point
The binding of the cooling devices to the trip point is left for the user.
触发点由 Thermal Zone 维护,每个 Thermal Zone 可以维护多个 Trip Point, 其包含的信息有:
temp: 当前温度
type: 类型,有以下方式:passive、active、hot、critical
cooling device: 绑定信息。
这个绑定信息指的是 Trip Point 和 cooling device 的绑定关系,即当 Trip Point 触发后由哪个 cooling device 去实施冷却措施。每个 Trip Point 要与 cooling device 绑定,才有其实际意义。
cooling device 是实际对系统实施冷却措施的驱动,是温控的执行者。cooling device 维护一个 cooling 等级 state, state 越高则表示系统的冷却需求越高(注意到 cooling device 只根据 state 进行冷却操作)。
🤔🤔🤔 state 这个取值是由谁决定的?state 的计算由 Thermal Governor 完成。
Source Code
dts 的配置:
thermal-zones {
cpu_thermal_zone {
polling-delay-passive = <1000>; //超过阀值轮询时间
polling-delay = <2000>; //未超阀值轮询时间
thermal-sensors = <&ths_combine0 0>;
trips {
cpu_trip0:t0 {
temperature = <70>;
type = "passive";
hysteresis = <0>;
};
上述代码为拷贝过来的,具体的理解,目前如下:
- 轮询时间有 2 个,如果超过了温度阈值,则缩短轮询的时间。
- @todo
Thermal Governal
Thermal Governal 是降温策略的一个抽象,与 cpufreq 的 governal 概念类似。
内核实现的策略定义如下:
(仅仅举例用,不是最新的代码实现,废弃)
struct thermal_governor {
char name[THERMAL_NAME_LENGTH];
/* 策略函数 */
int (*throttle)(struct thermal_zone_device *tz, int trip);
struct list_head governor_list;
};
Thermal Cooling Device
Thermal Cooling Device 是可以降温设备的抽象,如风扇。除此之外,还会包括CPU、GPU 这些,如何理解呢?
散热的方式有两种,一种是加快散热,一种是降低产热量,CPU、GPU 就是后者的体现。
struct thermal_cooling_device {
int id;
char type[THERMAL_NAME_LENGTH];
struct device device;
struct device_node *np;
void *devdata;
/* cooling device 操作函数 */
const struct thermal_cooling_device_ops *ops;
bool updated; /* true if the cooling device does not need update */
struct mutex lock; /* protect thermal_instances list */
struct list_head thermal_instances;
struct list_head node;
};
struct thermal_cooling_device_ops {
int (*get_max_state) (struct thermal_cooling_device *, unsigned long *);
int (*get_cur_state) (struct thermal_cooling_device *, unsigned long *);
/* 设定等级 */
int (*set_cur_state) (struct thermal_cooling_device *, unsigned long);
};
Thermal Core
Thermal Core 作为中枢注册 Governor, 注册 Thermal 类,并且基于 Device Tree 注册 Thermal Zone;
除此之外,提供 Thermal Zone 注册函数、Cooling Device 注册函数、提供将 Cooling 设备绑定到 Zone 的函数,一个 Thermal Zone 可以有多个 Cooling 设备;
提供了核心函数 thermal_zone_device_update 作为 Thermal 中断处理函数和轮询函数,轮询的时候会根据不同 Trip Delay 调节。
struct thermal_governor
对于 thermal_governor
结构体组成如下:
/**
* struct thermal_governor - structure that holds thermal governor information
* @name: name of the governor
* @bind_to_tz: callback called when binding to a thermal zone. If it
* returns 0, the governor is bound to the thermal zone,
* otherwise it fails.
* @unbind_from_tz: callback called when a governor is unbound from a
* thermal zone.
* @throttle: callback called for every trip point even if temperature is
* below the trip point temperature
* @governor_list: node in thermal_governor_list (in thermal_core.c)
*/
struct thermal_governor {
char name[THERMAL_NAME_LENGTH];
int (*bind_to_tz)(struct thermal_zone_device *tz);
void (*unbind_from_tz)(struct thermal_zone_device *tz);
int (*throttle)(struct thermal_zone_device *tz, int trip);
struct list_head governor_list;
};
name
: thermal governor 名称bind_to_tz
: 回调函数,callback called when binding to a thermal zone. 如果返回0
, 则 governor 绑定到 thermal zone 成功,否则失败unbind_from_tz
: 解绑回调函数throttle
:
callback called for every trip point even if temperature is below the trip point temperature. 意思就是说,每个触发点的回调,即使是温度低于触发点温度,也会回调这个函数;
在有些解释中,throttle
被认为是策略函数,其参数传入int (*thermal_governor::throttle)
governor_list
: governor 列表
list_head
结构体定义如下:
struct list_head {
struct list_head *next, *prev;
};